Samsung breaks ground on Onyang HBM packaging hub as Cheonan runs out of room

Poin penting

• Samsung has officially broken ground on a new high-bandwidth memory packaging hub located in Onyang, South Korea.
• The expansion comes as the existing facility in Cheonan has run out of space.
• This strategic development in Onyang is expected to help alleviate global AI memory shortages, significantly impacting international technology supply chains and South Korea's economic strategy.

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