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TSMC signs seven-year deal with Xintec to expand CoWoS packaging
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Poin penting
- Taiwan Semiconductor Manufacturing Company has entered into a seven-year agreement with Xintec to scale up its Chip-on-Wafer-on-Substrate packaging capabilities.
- This strategic partnership emphasizes the rising market demand for advanced semiconductor packaging technology.
- It also demonstrates the semiconductor industry's long-term reliance on CoWoS solutions to support next-generation hardware development across various tech sectors.
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- Crypto BriefingTSMC signs seven-year deal with Xintec to expand CoWoS packaging · 34 jam yang laluBaca di Crypto Briefing
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